KLM8G1WEMB-B031
SAMSUNG/三星
FBGA
22+
无铅/环保
企业名:深圳市迅丰达电子科技有限公司
类型:贸易/代理/分销
电话: 13824331138
手机:13824331138
联系人:陈小姐
微信:
邮箱:491961368@qq.com
地址:广东深圳赛格广场3504A
KLM8G1WEMB-B031原装EMMC
SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.0 which is a industry standard.
e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz DDR–up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance.
SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.0 which is a industry standard.
e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz DDR–up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance.
KLM8G1WEMB-B031原装EMMC的技术参数:
制造商 |
SAMSUNG |
封装 |
FBGA-153 |
容量 |
8GB(64G*1) |
封装尺寸 |
11.5 x 13 x 0.8 mm |
温度 |
-25°C TO 85°C |
电压规格 |
2.7V to 3.6V |
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企业名:深圳市迅丰达电子科技有限公司
类型:贸易/代理/分销
电话: 13824331138
手机:13824331138
联系人:陈小姐
微信:
邮箱:491961368@qq.com
地址:广东深圳赛格广场3504A