1.5SMC18A

The 1.5SMC18A series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications.

1.5SMC18A 应用

• 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%

• Excellent clamping capability

• Low incremental surge resistance

• Typical IR less than 1μA when VBR min>12V

• For surface mounted applications to optimize board space

• Low profile package

• Built-in strain relief

• Typical failure mode is short from over-specified voltage or current

• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

• IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)

• ESD protection of data lines in accordance with IEC 61000-4-2

• EFT protection of data lines in accordance with IEC 61000-4-4

• Fast response time: typically less than 1.0ps from 0V to BV min

• Glass passivated chip junction

• High temperature to reflow soldering guaranteed: 260°C/40sec

• VBR @ TJ = VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)

• Plastic package is flammability rated V-0 per Underwriters Laboratories

• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C

• Matte tin lead–free plated

• Halogen free and RoHS compliant

• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD- 609A.01)

1.5SMC18A

Parameter Symbol Value Unit

Peak Pulse Power Dissipation at

TA=25oC by 10/1000μs Waveform

(Fig.2)(Note 1), (Note 2), (Note 5)

PPPM 1500 W

Power Dissipation on Infinite Heat

Sink at TL

=50OC PD 6.5 W

Peak Forward Surge Current, 8.3ms

Single Half Sine Wave (Note 3) I

FSM 200 A

Maximum Instantaneous Forward

Voltage at 100A for Unidirectional

Only (Note 4)

VF 3.5/5.0 V

Operating Temperature Range TJ -65 to 150 °C

Storage Temperature Range TSTG -65 to 175 °C

Typical Thermal Resistance Junction

to Lead RθJL 15 °C/W

Typical Thermal Resistance Junction

to Ambient RθJA 75 °C/W

Notes:

1. Non-repetitive current pulse , per Fig. 4 and derated above TJ

(initial) =25OC per Fig. 3.

2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.

3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional

device only, duty cycle=4 per minute maximum.

4. VF

< 3.5V for single die parts and VF

< 5.0V for stacked-die parts.

5. The PPPM of stacked-die parts is 2000W and please contact littelfuse for the detail

stacked-die parts.

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