■Electronic Specification(电气持性)

Flux:

Specific gravity: 0.82 or more.

Flux shall be applied to the board using a bubble foaming type fluxer.

The board shall be soaked in the flux bubble only to the middle of its thickness.

Flux shall not come into contact with the component side surface.

Preheating:

Surface temperature of board:          100℃or less.

Preheating time :                    Within 2 min.

Soldering:

Solder temperature :                  260℃less.

Immersion time:                     Within 3 s.

6.3Apply the above soldering process for 1 or 2 times.

   ■Dimensions尺寸图

 

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类型：原厂制造商

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