特性High-Performance Static CMOS TechnologyUp to 150 MHz for TC = –55°C to 125°C

and Up to 100 MHZ for TC = 210°C1.9-V Core, 3.3-V I/O DesignHigh-Performance 32-Bit CPUIEEE-754 Single-Precision Floating-Point Unit (FPU))16 × 16 and 32 × 32 MAC Operations16 × 16 Dual MACHarvard Bus ArchitectureFast Interrupt Response and ProcessingUnified Memory Programming ModelCode-Efficient (in C/C++ and Assembly)Six Channel DMA Controller (for ADC, McBSP,

ePWM, XINTF, and SARAM)16-bit or 32-bit External Interface (XINTF)Over 2M × 16 Address ReachOn-Chip Memory256K × 16 Flash, 34K × 16 SARAM1K × 16 OTP ROMBoot ROM (8K x 16)With Software Boot Modes (via SCI, SPI, CAN,

I2C, McBSP, XINTF, and Parallel I/O)Standard Math TablesClock and System ControlDynamic PLL Ratio Changes SupportedOn-Chip OscillatorWatchdog Timer ModuleGPIO0 to GPIO63 Pins Can Be Connected to One

of the Eight External Core InterruptsPeripheral Interrupt Expansion (PIE) Block

That Supports All 58 Peripheral Interrupts128-Bit Security Key/LockProtects Flash/OTP/RAM BlocksPrevents Firmware Reverse EngineeringEnhanced Control PeripheralsUp to 18 PWM OutputsUp to 6 HRPWM Outputs With 150 ps MEP ResolutionUp to 6 Event Capture InputsUp to 2 Quadrature Encoder InterfacesUp to 8 32-bit/Nine 16-bit TimersThree 32-Bit CPU TimersSerial Port PeripheralsUp to 2 CAN ModulesUp to 3 SCI (UART) ModulesUp to 2 McBSP Modules (Configurable as SPI)One SPI ModuleOne Inter-Integrated-Circuit (I2C) Bus12-Bit ADC, 16 Channels80-ns Conversion Rate2 × 8 Channel Input MultiplexerTwo Sample-and-HoldSingle/Simultaneous ConversionsInternal or External ReferenceUp to 88 Individually Programmable, Multiplexed

GPIO Pins With Input FilteringJTAG Boundary Scan Support IEEE Standard 1149.1-1990

Standard Test Access Port and Boundary Scan ArchitectureAdvanced Emulation FeaturesAnalysis and Breakpoint FunctionsReal-Time Debug via HardwareDevelopment Support IncludesANSI C/C++ Compiler/Assembler/LinkerCode Composer Studio IDEDSP/BIOSDigital Motor Control and Digital Power

Software LibrariesLow-Power Modes and Power SavingsIDLE, STANDBY, HALT Modes SupportedDisable Individual Peripheral ClocksPackage OptionCeramic Pin Grid Array (GB)HLQFP (PTP)Temperature Range:GB Package: –55°C to 210°C (GB)PTP Package: –55°C to 150°C (PTP)APPLICATIONSControlled BaselineOne Assembly/Test SiteOne Fabrication SiteAvailable in Extreme (–55°C/210°C)

Temperature Range(1)Extended Product Life CycleExtended Product-Change NotificationProduct TraceabilityTexas Instruments high temperature products utilize

highly optimized silicon (die) solutions with design

and process enhancements to maximize performance over

extended temperatures.(1) Custom temperature ranges available

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