Note 1: General Applications - The power rating for 
general applications is based upon 0.5 sq. in. (300 
mm2
) of termination pad or trace area (2 oz. copper) 
connected to each end of the resistor. Maximum chip 
temperature is 150°C. Use Derating Curve to derate 
appropriay for the maximum ambient temperature 
and for the temperature limitations of the adjacent 
materials.
Note 2: Thermal Resistance - In High Power Applications where the circuit board material 
provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of 
the chip resistor is useful to establish the maximum power capability of the chip resistor in the 
application. The film temperature is measured at the center of the resistor element and solder 
pad temperature at the center of the solderable pedestal (point X in the recommended circuit 
layout shown below). Maximum temperature of the chip resistor (at the center of chip) should 
not exceed 150°C through the temperature range of the application.
Style FC Derating Curve For General Applications
AMBIENT TEMPERATURE,   C
RATED LOAD, %
o
100
80
60
40
20
0
0
C = Current connection
S = Sense connection
Note:  Actual width of current trace is based on 
magnitude of current.  Point of  connection should 
be

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