材料 Material

软性线路板FPC

软软硬结合Rigid---FlexPCB

注解测试方式

Remark＆Test method

层数 Layers

1—10 2--10

*小线宽线距Width/space

Single-sided 0.05mm(2mil)

Double-sided 0.05mm(2mil)

尺寸公差

Dimension

tolerance

线宽

Line width

+/-0.03mm

W<=0.15mm

H<=1.5MM

P<=10MM

Specicl +/-0.07mm

Specicl +/-0.075mm

孔径hole

+/-0.02mm

间距

Cumulate space

+/-0.05

外形outline

+/-0.1mm

Confuctor to outline

+/-0.1mm

*小孔径

Hole(min)

钻孔Drill

0.15mm

冲孔Punching

0.50mm

表面工艺

Surface treament

镀镍/镀金Ni/Au plating

Ni :2-8un(80uin-320uin)

Au:0.05-0.125um(2uin-5uin)

沉金电镍Electronic Nickle Immersion Gold(ENIG)

镍Ni:3-5um(120uin-200uin)

金Au>=0.05nm(2uin)

Or specified by Customer

Bonding:Ni:2-6um Au>=0.2um(thick Au)

镀锡

Tin Plating

10-20um或者客户指定

10-20um or specified by customer

表面*拉强度

Peel strength

胶粘剂Adhesive:1.0mil

1.0kgf/cm 1.0kgf/cm

*-TM-6502.4.9

胶粘剂Adhesive:0.5mil

0.5kgf/cm 0.5kgf/cm

焊剂高温特性

Solder heat resistance

300℃/10sec 300℃/10sec

*-TM-6502.4.3

*缘电阻Insulation Resistance

500MΩ 500MΩ

*-TM-6502.6.3.2

额定电压

Dielectric with standing voltage

500V 500V

*-TM-6502.5.7

化学*性

Chemical Resistance

无色变

No discoloration

No discoloration

*-TM-6502.3.2

热量变化Thermal block

阻值变化不能*过+/-10%

*-TM-6502.6.7.2