6232 Series | 1.0mmPitch LIF Right Angle/Vertical SMT/Through Hole T*e |
| Series | 6232 | | No. of Positions | 3 to 31 | | Profile Height | | RA | 3.0mm | ![]() | ![]() | | Vertical,PTH | 5.5mm | ![]() | ![]() | | Vertical,SMT | 5.1mm |
| | Contact Location | | RA | Top contact
Bottom contact | ![]() | ![]() | | ST | Single sided contact |
| | Pitch | 1.0mm | | Rated Current | AC/DC 0.5A | | Rated Voltage | AC/DC 50V | | Withstanding Voltage | AC 500Vrms/min. | | Applicable FPC thickness | 0.3mm |
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 Outline | ![]() | | Series 6232 is 1.0mm pitch, LIF, cost advantage design. Available variation are SMT / Through Hole version. SMT version is Vertical, Right Angle, * contact, bottom contact. Through Hole version is Vertical, Right Angle, bottom contact only. The SMT version can be packed in tape and reel for automatic mounting. |
| Features | ![]() |
| (1) | Contact Material: Copper alloy | | (2) | Insulator Material: Heat resistance plastic | | (3) | Operating Temperature Range: -20 to 85°C | | (4) | Plating Specifications |
Thorough Hole T*e| Plating Code | Contact Area | Tail Area | Metal tab | RoHS Compliance | | 000 /800 | Sn | Sn | Sn-Cu | Yes | | - | Yes | | 000/800 | Sn | Sn | Sn-Pb | No | | - | Yes | | 868 | Au(0.05µm Min.) | Au(0.03 to 0.1µm) | Sn-Cu | Yes | | - | Yes |
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SMT T*e| Plating Code | Contact Area | Tail Area | Metal tab | RoHS Compliance | | 000 /800 | Sn-Cu | Sn-Cu | Sn-Cu | Yes | | - | Yes | | 000/800 | Sn-Pb | Sn-Pb | Sn-Pb | No | | - | No | | 868 | Au(0.05µm Min.) | Au(0.03 to 0.1µm) | Sn-Cu | Yes | | - | Yes |
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