田村锡膏/SAC305锡膏/TLF-209-111M

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LFSOLDER TLF-209-111M

1. Features

1) Pb-free (Sn/Ag/Cu series) solder alloy.

2) Stable printability with little change in viscosity during continuous printing.

3) Reduces void formatin.

4) Reduces mid-chip solder balls.

5) Does not slump in pre-heat.

6) Excellent solderability at high temperature.

7) Excellent solderability on fine pitch patterns of 0.5mm pitch CSP.

2. Characteristics

Characteristics of LFSOLDER TLF-209-111M is shown in Table 1 and Table 2.

Table 1 - Characteristics of LFSOLDER TLF-209-111M

Items	Characteristics	Test methods
Alloy composition	Sn 95.75 / Ag 3.5 / Cu 0.75	JIS Z 3282(1999)
Melting point	217～219℃	According to DSC measurement
Particle size of solder powder	20～41μm	Measure by laser diffraction method
Shape of solder powder	Spherical	Annex 1 to JIS Z 3284(1994)
Flux content	10.9%	JIS Z 3284 (1994)
Chlorine content※	0.0%	JIS Z 3197 (1986) 6.5
Viscosity	220 Pa･s	Annex 6 to JIS Z 3284(1994) Viscometer, t*e PCU, manufactured by Malcom, at 25℃

※Result of examination in flux.

Table 2 - Characteristics of LFSOLDER TLF-209-111M

Items	Characteristics	Test methods
Water solution resistance test	More than 5×10⁴ Ω･cm	JIS Z 3197 (1999)
Insulation resistance test	More than 1×10⁹Ω	Board t*e 2,Annex 3 to JIS Z 3284(1994)
Slump test	Less than 0.2mm	Print the paste on ceramics board and heat for 60 seconds at 150℃. Measure slump width from before and after heating. STD-09*※
Solder ball test	Solder balls seldom occur	Print the paste on ceramics board. After melting and heating, observe with a microscope of 50 times. STD-009e※
Solder spread test	More than 76%	JIS Z 3197 (1986) 6.10
Copper plate corrosion test	No corrosion	JIS Z 3197 (1986) 6.6.1
Tackiness test of residue	P*	Annex 12 to JIS Z 3284(1994)