供应商

Micron Technology

产品类别

Flash

说明

SLC NAND Flash Parallel 1.8V 1G-bit 128M x 8 63-Pin VFBGA Tray

产品技术规格

欧盟限制某些有害物质的使用

Compliant

ECCN (US)

3A991.b.1.a

Part Status

Obsolete

HTS

8542.32.00.71

Cell Type

SLC NAND

Chip Density (bit)

1G

Architecture

Sectored

Boot Block

Yes

Block Organization

Symmetrical

Address Bus Width (bit)

28

Sector Size

128Kbyte x 1024

Page Size

2Kbyte

Number of Bits/Word (bit)

8

Number of Words

128M

Programmability

Yes

Timing Type

Asynchronous

Maximum Erase Time (s)

0.003/Block

Maximum Programming Time (ms)

0.6/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.95

Operating Current (mA)

20

Program Current (mA)

20

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Command Compatible

No

ECC Support

Yes

Erase Suspend/Resume Modes Support

No

Simultaneous Read/Write Support

No

Support of Common Flash Interface

No

Support of Page Mode

Yes

Packaging

Tray

Standard Package Name

BGA

Supplier Package

VFBGA

Pin Count

63

Mounting

Surface Mount

Package Height

0.65

Package Length

11

Package Width

9

PCB changed

63

Lead Shape

Ball

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