品牌:HOODYU 型号:多样 机械刚性:刚性 层数:双面 基材:铜 *缘材料:*树脂 *缘层厚度:常规板 阻燃特性:VO板 加工工艺:电解箔 增强材料:玻纤布基 *缘树脂:环氧树脂(EP) 产品性质:* 营销方式:* 营销价格:*
生产能力:
生产尺寸 | Working Panel Size: |
*大:20.47×24.41(520mm*620mm) | Max. :20.47″×24.41″(520mm×620mm) |
*小:0.98×1.06(25mm*27mm) | Min. :0.98″×1.06″(520mm×620mm) |
板翘曲度:*大1.0%;*小0.5% | Bow and Twist : Max.1.0%; Min. 0.5% |
压板公差:&plu*n;0.002(0.051mm) | Press-fit Tolerance :&plu*n;0.002″(0.051mm) |
*小孔距/孔径: | Min. Drill Hole/Land |
内层:4mils(0.1mm)/4mils(0.1mm) | Inner : 10mils(0.25mm)/20mils(0.50mm) |
外层:4mils(0.1mm)/4mils(0.1mm) | Outer : 10mils(0.25mm)/20mils(0.5mm) |
层数:2~10层 | Layers Counts: 2 to 10 Layers |
*小完成孔径:8mils(0.20mm/次) | Min. Finished Vias :8 mils(0.20mm/finishing) |
线宽/线距: | Trace / Space: |
内层:4/4mils(0.10mm) | Inner Layer : 4 / 4 Mils (0.10mm) |
外层:4/4mils(0.10mm) | Outer Layer :4 / 4 Mils(0.10mm) |
SMT*小间距:16mils(0.4mm) | Min. SMT Pitch : 16 Mils (0.4mm) |
*小绿油桥:3.0mils(0.076mm) | Min. Solder-mask bridge :3.0 mils(0.076mm) |
*小开窗:1.5mils(0.04mm) | Min. Solder-mask opening : 1.5 mils(0.04mm) |
板厚:16~157mils(0.4~4.0mm) | Board Thickness : 16~157mils(0.4-4.0mm) |
*小孔径:8mils(0.20mm) | Min.. Vias : 8 mils(0.20mm) |
孔径纵横比:6:1 | Aspect Ratio : 6:1 |
干膜*孔能力:6mils(0.15mm) | Dry Film Sealing Capacity : 6mils(0.15mm) |
孔位偏差:&plu*n;2mils(0.051mm) | Hole Position deflection :&plu*n;2mils(0.051mm) |
表面处理: | Finish Process (out of KG) |
喷锡;非ROHS要求 | HASL : Not ROHS requirement |
沉银、沉锡:*合ROHS要求 | Immersion Silver, Immersion Tin : ROHS compatible |
镀金、沉金:*合ROHS要求 | Flash Gold Plating, Immersion Gold : ROHS compatible |
铳金手指、*氧化:*合ROHS要求 | Finger Plating, ENTEK : ROHS compatible |
无锡喷锡:*合ROHS要求 | Lead Free HASL : ROHS compatible |
友情链接: 深圳市元东发电子有限公司