Style FC - Flip Chip version for surface mount applications.
Style WB - Wire Bond version for hybrid applications with metallized back
 surface for solder down heat sinking of the chip, includes bondable termination
 pads to receive aluminum wire bonds.
• Thermal resistance is provided to optimize high power designs when utilizing
 higher thermal conductivity circuit board substrates such as IMS or Alumina.
• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,
 and 0.10 ohm at ±1%.
• Low inductance provides excellent high frequency and pulse response.
• High pulse handling and overload capability.
• Best choice for switching power supplies, motor speed controls, and high
 current sensing applications

企业名：西安尚平电子科技有限公司

类型：其他

电话： 029-81777783

手机：18092826768

联系人：马女士

QQ：

邮箱：xacomponents@163.com

地址：陕西西安长安南路449号