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| 特点 | | Features |
| ■ 芯片与底板电气*缘，2500V交流电压 | | ■ The chip and base-board are electric-insulation, 2500V AC voltage |
| ■ 芯片与底板电气*缘，2500V交流电压 | | ■ Packing with international standard |
| ■ 全压接结构，优良的温度特 性和功率循环能力 | | ■ Compley press-connection structure, with * temperature properties and power-cycling capability |
| ■ 200A以下模块皆为强迫风冷，300A以上模块，既可选用风冷，也可选用水冷 | | ■ The module below 200A are all forced wind-cooling, the module above 300A could select wind cooling or water-cooling for use. |
| ■ 安装简单，使用维修方便 | | ■ The installation,use as well as maintenance are simple |
| ■体积小，重量轻 | | ■ Small volume and light weight |
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| 典型应用 | | T*ical-application |
| ■ 逆变器 | | ■ Contravariant device |
| ■ 感应加热 | | ■ Induction heating |
| ■ 斩波器 | | ■ Chopper |
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| 说明 | | Instruction |
| ■ VDSM/VRSM=VDRM/VRRM+200V | | ■ VDSM/VRSM=VDRM/VRRM+200V |
| ■ 除非另作说明，IGT、VGT、IH、VTM、VFM、Viso均为25℃下的测试值。表中其它参数皆为Tjm下的测试值。 | | ■ Only if proved separay, theIGT、VGT、IH、VTM、VFM、Visoare the tested value below 25℃, other parameters inside form all are the tested value below Tjm |
■ I2t=I2TSMtw/2；式中tw：正弦半波电流底宽
在50Hz频率下，I2t(10ms)=0.005I2TSM(A2S) |
| | | ■ I2t=I2TSMtw/2；式中tw：正弦半波电流底宽 |
the tw inside equation is sine semi-wave current base-width, in the case of 50Hz, |
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■ 当使用在频率为60Hz情况下，
| | ■ If used in the case of frequency below 60Hz, |
| ITSM(8.3ms)=1.066ITSM(10ms),I2t(8.3ms)=0.943I2t(10ms) | | ITSM(8.3ms)=1.066ITSM(10ms),I2t(8.3ms)=0.943I2t(10ms) |
