型号:*锡膏Sn96.5Ag3.0Cu0.5 粘度:2.0（Pa·S） 颗粒度:2.0（um） 品牌:聚峰 规格:多款供选 合金组份:SnAgCu *:高 类型:锡膏Sn96.5Ag3.0Cu0.5 熔点:217
锡膏
Solder Paste
聚峰锡膏是用**声波雾化工艺自制的低含氧量真圆焊锡粉沫和基于日本*焊接技术加以自主研发改良的助焊膏配制而成，整个生产均为真空或氮气环境中完成的。具有较高的*耐塌陷性及良好的印刷性等，适合于细间距印刷，且在印刷后，均可保持长时间的粘著性。
jufengsolder paste is made up of solder powder with low oxygen content,high roundness after advanced ultrasonic atomizing processes and soldering flux,independently rsearched and improved process based on the advanced Japanese soldering technology. The entire production is completed under the vacuum or nitrogen gas environment. It has comparatively high collapse resistance and good printabilityetc, so it is adaptable to print at fine pitch and can maintain long-term adhesiveness 。
| 无铅焊锡膏 |
无铅焊锡膏是设计用于当今 SMT 生产工艺的一种免清洗型焊锡膏。采用氧化量*少的无铅合金与无*较好的助焊膏配制而成，粘度可满足印刷与点涂工艺，应用范围十分广泛。 |
友情链接： 深圳市元东发电子有限公司
