产品名称
Name of products

产品性能
Product performance

使用说明
Operation instructions

稀释剂
Diluting agent

用于降低助焊剂的固体含量或补充挥发掉的溶剂，*助焊剂维持在*佳效能。
Used to reduce solid content of soldering flux or supply solvents evaporated so as to ensure that the soldering flux will be maintained at its optimal performance.

测量使用中的助焊剂比重，添加稀释剂至助焊剂的标准比重的　&plu*n;0.01。
Used to measure the weight of soldering
flux in application and to add thinner to
0.01 of the standard weight.

清洗剂
Cleaning agent

用于清除焊接残留物及油污，*合*要求。
Used for rinsing, remove residues and grease/dirt out of soldering so as to meet the requirements of environments.

可用于刷洗和机洗
Used for brushing and machine washing

抹机水
Machine cleaner

用于清除机壳和线材表面油污，挥发快，表面*物。
Used to remove grease and dirt on the surfaces of housings and wire materials. It is easy for volatility without residues on their surfaces.

直接擦拭
Direct wiping

还原粉
Reduced powder

此还原粉与锡渣混合搅拌后，能将锡渣中80%的氧化锡还原为焊锡合金，由于锡渣中的焊锡又回到锡槽，故锡条的使用量亦相对减少，可节约大量焊锡成本。
After this reduced powder is mixed with the solder splash, it can recover 80% of solder splash into solder alloy. Since the solder in the solder splash returns to tin baths, so the application of bar solders will decrease accordingly so as to save plenty of cost in soldering.

先将锡渣收集在波峰焊锡炉旁一个角落放上还原粉（还原粉:锡渣1:100），搅拌半分钟，关闭波峰焊门，10～15分钟后才把锡渣捞出锡炉。
First collect the solder splash at one corner of a solder pot for wave soldering and place reduced powder on it (reduced powder : solder splash at 1:100). After mixing them for a half minute, close the door for wave soldering. 10 to 15 minutes later, get solder splash out of the solder pot.