ELE*RICAL
1. INDU*ANCE AT 100mVDC BIAS: 350μ H MAX.
2. C W/W(pF MAX):28 pF
3. LEAKAGE INDU*ANCE AT 100KHz DC 100mV:0.3μ H MAX.
4. INSULATION LOSS: 1.0dB MAX @1-80 MHz 1.2dB MAX @ 100 MHz 5. RETURN LOSS: 14dB MIN @ 1-60 MHz 10dB MIN @ 60-100 MHz 6. CROSS TALK: 35 dB MIN @ 1-80 Mhz
MECHANICAL
1. MATING FORCE: 2.27 Kgf MAX
2. DURABILITY: 750 CYCL* MIN 3. PCB RETENTION PRE-SOLDER:1LB MIN
ENVIRONMENTAL
1. STORAGE :-40℃~85℃
MAT* WITH MODULAR PLUG CONFORMING TO FCC PART 68,SUBPART F.
FEATUER 1. RJ45 10/100 BASE-TX TRANSFORMER JACK WITH TRANSFORMER/IMPEDANCE R*ISTOR/HIGH VOLTAGE CAPACITOR 2. SIZE SAME AS RJ45 MODULAR JACK TO S*E PCB BOARD SPACE 3. REDUCE EMI RADIATION,IMPROVE EMI PERFORMANCE 4. D*IGNED FOR NETWORK INTERFACE CARD APPLICATION 5. D*IGNED TO MEET IEEE 802.3u REQUIREMENT 6. D*IGHED FOR 100 BASE TRANSMISSION OVER UTP-5 CABLE 7. OPERATION TEMPERATURE RANGE:0℃~70℃ | 
