NuSil LS-3354 

A&B1：1配比
1.54折射率
98%以上透光性
混合粘度为5400CPS
硬度为000-65
良好的耐UV特性
耐温-40℃~200℃
能承受260℃回流焊1~2分钟

Instructions for Use

Thoroughly mix Part A with Part B in a 1:1 mix ratio by weight or volume. Deviations from the

1:1 mix ratio may change cure rates. Airless mixing, metering and dispensing equipment are

recommended for production processing.

Deaeration

Remove air entrapped during mixing by common vacuum deaeration procedure, observing all

applicable safety precautions. Slowly apply vacuum, up to 28 inches Hg, to a container rated

for use and of volume at least four times that of material being deaerated. Hold vacuum until

Packaging

20 Gram Kit

50 Gram Kit

50 ml SxS Kit

2 Pint Kit (910 g)

Warranty

6 Months

presence of air is no longer evident.

Substrate Considerations

Cures in contact with most materials, exceptions include: butyl and chlorinated rubber, some RTV silicones and unreacted

residues of curing agents used with a few t*es of plastics.

Note:Some bonding applications may require the use of a primer. NuSil Technology LLC LS1-3200 silicone primer is

recommended.

NuSil LS-3351概述：
  
1、 LS-3351 A&B 1：1双组分硅胶
2、1.51折射率，95%以上高透光性，混合后粘度6000CPS 00055凝胶；
3、100度一小时固化；
4、耐温-40~200度，可通过260度回流焊1~2分钟

Instructions for Use

The product is supplied in ready-to-use cartridges that mix the material automatically as it is dispensed

without need for vacuum deg*ing.

Deaeration

The *embly should self-deaerate due to the product’s long room temperature work time and low

viscosity, as long as no pockets of air are trapped beneath mechanical parts. If accelerated deaeration is

required, the *embly may be vacuum deaerated using a pressure of 635 mmHg (25 inHg) or greater.

Apply the vacuum while observing the uncured fluid for presence of bubble formation and increase

vacuum slowly enough to avoid rapid foaming. Hold vacuum until bubbles at the fluid surface

Packaging

50 ml SxS Kit

20 Gram Kit

2 Pint Kit (910 g)

Warranty

6 Months

collapse and are no longer visible.

Cure Inhibition

LS-3351 cures in contact with most properly cleaned substrate materials including optical gl*es, optical plastics, and photonic

semiconductors. Adhesion to fluoroplastic substrates is generally poor but may be improved with chemical etching or pla*a etching

of the substrate. Substrates to avoid include certain butyl, nitrile, chlorinated, and EPDM elastomers, certain plastics with leachable

plasticizers, and the cure residues of certain adhesives including UV-cured epoxies and amine-cured epoxies.

企业名：深圳市博明瀚电子有限公司

类型：经销商

电话： 755-29021090

联系人：吉长波

地址：广东深圳中心区创业一路宏发中心大厦917室