Features

• Halogen free
• RoHS compliant for global applications
• Lead free
• Ultra-low capacitance (0.05pF t*.) ideal for high speed data applications
• Provides *D protection with fast response time (<1ns) allowing equipment   to p* IEC 61000-4-2 level 4 test
• Single-line, bi-directional device for placement flexibility
• Low profile 0402/1005 design for board space savings
• Low leakage current (<0.1nA t*.) reduces power consumption
• (Sn) Tin-plated version available

Design Considerations

The location in the circuit for the MLP series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current *ociated with an *D event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground).

Soldering Recommendations

• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:

- IR Reflow = 260°C max for 10 sec. max.

- Wave Solder = 260°C max. for 10 sec. max.