ALPHAOM338T45无铅锡膏 ULTRA FINE FEATURE LEAD-FREE SOLDER PASTE D*CRIPTION ALPHA OM-338-T45 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-T45’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-T45 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-T45 is formulated to deliver excellent visual joint co*etics. Additionally, ALPHA OM-338-T45’s capability of * Cl* III for voiding and ROL0 * cl*ifications ensures maximum long-term product reliability. *Although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-lead or tin-lead-silver. FEATUR* & BENEFITS               Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as *all as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.               Excellent print consistency with high process capability index across all board designs.               Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.               Wide reflow profile window with good solderability on various board / component finishes.               Excellent solder and flux co*etics after reflow soldering               Reduction in random solderballing levels, minimizing rework and increasing first time yield               Meets highest * 7095 voiding performance cl*ification of Cl* III.               Excellent reliability properties, halide-free material               Compatible with either nitrogen or air reflow   PRODU* INFORMATION Alloys: SA05 (95.5%Sn/4.0%Ag/0.5%Cu) Powder Size: T*e 4.5 Residues: Approximately 5% by (w/w) Packaging Sizes: 500 gram jars, Lead Free: Complies with RoHS Directive 2002/95/EC. APPLICATION Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 200mm/sec (8”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in conjunction with ALPHA® Stencils. Blade pressures should be 0.16-0.34 kg/cm of blade (0.9 -2Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good co*etics and minimized rework.

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