D*CRIPTION

Silicon Microstructures provides its two most popular pressure sensor die in surface mount dual in-line package (SO16) configuration. All parts in these series are uncompensated high-performance die mounted in an injection-molded package designed for surface mounting.

These packaged sensor die provide a way for OEM manufacturers to incorporate pressure sensors at costs close to raw die prices, without the need to handle, attach or wire bond silicon sensor die.

Options include variety of pressure ranges, absolute or gauge pressure t*es, and a choice of cap configurations. The result is a versatile product line suitable for a wide range of applications.

The low-pressure series (modelSM5470) incorporates Silicon Microstructure’s unique low-pressure die to achieve high performance in pressure ranges from 0.15 PSI to 3.0 PSI full-scale in gauge and differential.

The modelSM5430comes in gauge, differential, and absolute for pressure ranges from 5 PSI to 60 PSI full scale.