MCF5484CVR200

NOTES:

1 θJA and Ψjt parameters are simulated in accordance with EIA/JESD Standard 51-2 for natural convection.

Freescale recommends the use of θJA and power dissipation specifications in the system design to prevent device

junction temperatures from exceeding the rated specification. System designers should be aware that device

junction temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the

device junction temperature specification can be verified by physical measurement in the customer’s system using

the Ψjt parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.

2 Per JEDEC JESD51-6 with the board horizontal.

3 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL

SPEC-883 Method 1012.1).

5 Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter

is written as Psi-JT.

MCF5484CVR200产品图片：

MCF5484CVR200参数：

型号：MCF5484CVR200

品牌：FREESCALE

封装规格：BGA

存储环境：常温

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