陶瓷覆铜板（Direct Bonding Copper ,英文缩写为DBC或DCB），是铜箔和陶瓷基片在高温、惰性气体中通过高温熔炼和扩散过程而形成的一种高载流能力、高导热、高绝缘强度的电路板材料。它广泛应用于高功率密度、功能集成、高可靠性功率半导体模块封装及一些新型电子产品。

技术性能优势：

l          铜箔和陶瓷直接结合，导热性能优异，氧化铝-DBC热导率为24~28 W/(m·K)，AlN-DBC为170~220 W/(m·K) 。

l          良好的绝缘性能。

l          在各种使用条件下的长久稳固性。

l          和硅接近的热膨胀系数可以使焊接在上面的半导体芯片避免承受温度变化带来的应力冲击。

l          可以像PCB一样容易的加工出各类图形和线路，较强的电流导通能力使电力电子产品轻松地实现板上芯片互联功能，载流量可达100安培/毫米。

l          CPV光伏模块

固态继电器

l          晶闸管模块

l          IGBT模块

l          电子加热和制冷

l          LED封装组件

Technological and performance advantages:

l          The direct combination of the copper foil and ceramics results in the excellent heat conducting performance. The thermal conductivity of aluminum oxide is 24~28 W/(m·K), and that of AlN-DBC is 170~220 W/(m·K).

l          Excellent dielectric performance

l          Long-term stability under all kinds of using conditions.

l          The thermal expansion coefficient, which approximates to that of silicon, enables the semiconductor chips which are welded thereon to avoid the stress impact caused by the change of temperature.

l          It is easy to process the material to make all kinds of shapes and circuit as easily as PCB. Its high current conductivity enables electric and electronic products to realize the combination of functions with ease. The largest capacity is as much as 100 A/mm.

l          CPV photovoltaic modules

Solid State Relay

l          Thyristor modules

l          IGBT modules

l          Electronic heating and cooling

l          LED encapsulation component

企业名：潍坊高德电子有限公司

类型：生产企业

电话： 0536-3515199

手机：13573377229

联系人：孙经理

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邮箱：535753738@qq.com

地址：山东潍坊潍坊市青州经济开发区海岱北路1299号