1

Max layer counts
*高层数

30 L

2

Max Copper Thickness
*大铜厚

6 OZ

3

Min Hole Diameter
*小孔径

0.15mm

4

Min Line W/S
*小线宽/线距

0.08/0.08mm

5

Max Aspect Ratio
*大纵横比

10:1

6

Finished BoardThickness
完成板厚度

0.4-4.0mm

7

Min Core Thickness
*小芯板厚度

0.20mm

8

Hole Position
孔位公差

0.075mm

9

PTH Diameter Tolerance
PTH孔径公差

0.075mm

10

NPTH Diameter Tolerance
NPTH孔径公差

0.05mm

11

Outline Dimension Tolerance
外形尺寸公差

0.13mm

12

Isolation fro Electrical Test
测试*缘电阻

>30MΩ

13

Top to Back Shift Toleracne
层间对准度公差

0.075mm

14

Test Voltage for Electrical Test
测试电压

250V Max

15

Base Material
基材

FR-4,FR-4 High Tg,
Rogers,Arlon,Taconic RF
Laminates,Metal Clad

16

Surface Treatment
表面处理

HASL,Leadfree HASL,
ENIG,Immersion Tin,
Immersion Silver,OSP

17

Solder Mask Color
阻焊颜色

Green,Matte Green,Yellow,
Blue,Red,Black,White