项目

内容

常规

*

1

层数

*.OF LAYER

1～6层

8层

2

完成板尺寸(*大)

FINISHED BOARD SIAE (MAX)

250*650mm

OK

3

完成板尺寸(*小)

FINISHED BOARD SIAE (MIN)

8mm*12mm

OK

4

板厚度(*大)

BOARD THICKN*S (MAX)

23 mil (0.6mm)

OK

5

板厚度(*小)

BOARD THICKN*S (MIN)

3 mil (0.0765mm)

（*焊）0.05mm

6

成品厚度公差(0.085mm≦板厚<0.4mm)

FIN*HED BOARD THICKN*S FOLERANCE

(0.085MM≦BOARD THICKN*S<0.4mm)

&plu*n;2mil(&plu*n;0.05m)

OK

7

钻孔孔径(*大)

DRILL HOLE DIAMETER (MAX)

240 mil (6.0mm)

6.5mm

8

钻孔孔径(*小)

DRILL HOLE DIAMETER (MIN)

8 mil (0.20mm)

0.15mm

9

外形精度

&plu*n;0.1mm

&plu*n;0.05mm

10

完成孔径(*小) For machine drill

FIN*HED VIA DIAMETER (MIN)

6 mil (0.15mm)

0.10mm

11

底铜厚度(*小)

OUTER LAYER BASE COPPER THICKN*S (MIN)

1/2OZ(18um)

1/3OZ

12

底铜厚度(*大)

OUTER LAYER BASE COPPER THICKN*S (MAX)

2OZ(72um)

3OZ

13

*缘层厚度(*小)

INNER LAYER DIELE*RIC THICKN*S (MIN)

0.0127mm(PI厚1/2mil)

OK

14

*缘层厚度(*大)

INNER LAYER DIELE*RIC THICKN*S (MAX)

0. 50mm(PI厚2mil)

OK

15

材料类型

BASE.MATERIAL

PI聚酰亚胺/PET聚脂

无胶基材

16

孔电镀纵横比(*大)

HOLE PLATING ASPE* RATIO (MAX)

5:1

OK

17

孔径公差(镀通孔)

HOLE DIAMETER TOLERANCE (PTH)

&plu*n;3mil(&plu*n;0.076 mm)

OK

18

钻孔孔径公差(非镀通孔)

HOLE DIAMETER TOLERANCG (NPTH)

&plu*n;2mil(&plu*n;0.050mm)

OK

19

孔位公差(与CAD数相比)

HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA)

&plu*n;1mil(&plu*n;0.025mm)

OK

20

PTH孔孔壁铜厚

PTH HOLE COPPER THICKN*S

≧0.5mil(≧12.5um)

≦1.0mil(≦25 um)

≧8.0um