84-1LMISR4
爱博斯迪克
单组份，导热系数25W/mK，适合3-5W大功率LED和模组。自动点胶机适用。 Introduction Die Attach Paste ”KEMITITE *285” is epoxy resin based and solvent free T*e paste. The highest thermal conductivity (25W/mK) Good reflow performance due lower moisture absorption resin system. *285 is effectively used for power IC, transistor. Features1） Good workability for dispensing due to solvent free and one liquid t*e paste. 2） Highest thermal conductivity(25W/mK) 3） Bleed less. General PropertyProperties Unit T*ical Value Test Method Appearance – Silver Filled Paste Visual Viscosity at 25CPa·s100EHD Viscometer 0.5rpm3°cone) Thixotropic Index –6.0 0.5rpm/2.5rpm Non Voletile Wt%92.0 180C×2hr Silver Content Wt%87.5 600C×3hr Adhesive Strength 25c300CN3020 Frame: Cu/PPF Chip Size: 2×2mm Volume Resistivity Ohm.cm 8×10-6 Cure: 200C×90min Measurement: Room Temp Gl* Transition Temperature C200TMA Modulus(25C) 25CGPa16.5DMA 260C 7.8 *E Alpha 1Ppm75TMA Alpha 2 200
